PRINTED CIRCUIT BOARD SOLUTIONS
SRXGlobal' Design for Manufacturability (DfM) review process aims to identify potential issues which could impact adversely on the cost, manufacturability and time-to-market of new products. The reviews, which are conducted at schematic, Printed Circuit Board (PCB) layout, prototype, pilot run and pre-production phases, focus on:

Component selection: commonality, package type, availability, lead times, cost, alternatives and customer preferences;

Process consideration: temperature sensitivity, auto placability, component markings, gluing or wave soldering, minimum process types and flip flop panelisation;

Printed Circuit Board layout: minimised inter package spacing, component orientation, primary and secondary sides, solder thieves, auto and hand insertion hole sizes and land pattern designs;

Printed Circuit Board selection: material specifications, surface finishes, component legends, panelisation, tooling strips and holes and fiducial marks. Good Printed Circuit Board Layout techniques require understanding of the effects of non-zero impedances of printed circuit traces and coupling of signals from one circuit to another through parasitic capacitances and radio transmission, as well as basic understanding of circuit operation.

Effective product management must go beyond outdated, habitual steps of acquiring and implementing product and process technology as the final solution. SRXGlobal addresses project management practices to consider your needs, designing those requirements into the required product and ensuring the company has the capability to effectively produce the product.